link to page 5 AD8343ABSOLUTE MAXIMUM RATINGSTable 4. Stresses above those listed under Absolute Maximum Ratings Parameter Rating may cause permanent damage to the device. This is a stress VPOS Quiescent Voltage 5.5 V rating only; functional operation of the device at these or any OUTP, OUTM Quiescent Voltage 5.5 V other conditions above those indicated in the operational INPP, INPM Voltage Differential 500 mV (Either Polarity) section of this specification is not implied. Exposure to absolute LOIP, LOIM Current 1 mA maximum rating conditions for extended periods may affect (Injection or Extraction) device reliability. LOIP, LOIM Voltage Differential 500 mV (Either Polarity) ESD CAUTION Internal Power Dissipation (TSSOP)1 320 mW θJA (TSSOP) 125°C/W Maximum Junction Temperature 125°C Operating Temperature Range −40°C to + 85°C Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering 60 sec) 300°C 1 A portion of the device power is dissipated by external bias resistors, R3 and R4. Rev. B | Page 5 of 32 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS BASIC OPERATING INSTRUCTIONS TYPICAL AC PERFORMANCE TYPICAL ISOLATION PERFORMANCE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS RECEIVER CHARACTERISTICS TRANSMIT CHARACTERISTICS CIRCUIT DESCRIPTION DC INTERFACES BIASING AND DECOUPLING (VPOS, DCPL) POWER-DOWN INTERFACE (PWDN) AC INTERFACES INPUT INTERFACE (INPP AND INPM) SINGLE-ENDED-TO-DIFFERENTIAL CONVERSION INPUT MATCHING CONSIDERATIONS INPUT BIASING CONSIDERATIONS OUTPUT INTERFACE (OUTP, OUTM) OUTPUT MATCHING CONSIDERATIONS OUTPUT BIASING CONSIDERATIONS INPUT AND OUTPUT STABILITY CONSIDERATIONS LOCAL OSCILLATOR INPUT INTERFACE (LOIP, LOIM) DC COUPLING THE LO A STEP-BY-STEP APPROACH TO IMPEDANCE MATCHING Circuit Setup Establish Target Impedance Measure AD8343 Differential Impedance at Location of First Matching Component Design the Matching Network Transfer the Matching Network to the Final Design APPLICATIONS DOWNCONVERTING MIXER UPCONVERTING MIXER EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE
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