Datasheet MBRS320P, MBRS330P, MBRS340P (ON Semiconductor) - 4

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SMC 2−LEAD
CASE 403AC ISSUE B DATE 27 JUL 2017
SCALE 1:1
NOTES:
HE
1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES.
E
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H. 5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA DETERMINED BY DIMENSION L.
MILLIMETERS INCHES D DIM MIN MAX MIN MAX A
1.95 2.61 0.077 0.103
A1 c A1
0.05 0.20 0.002 0.008
DETAIL A A2
1.90 2.41 0.075 0.095
b
2.90 3.20 0.114 0.126
TOP VIEW c
0.15 0.41 0.006 0.016
D
5.55 6.25 0.219 0.246
DETAIL A E
6.60 7.15 0.260 0.281
HE
7.75 8.15 0.305 0.321
A2 A L
0.75 1.60 0.030 0.063
GENERIC L b MARKING DIAGRAM* SIDE VIEW END VIEW
AYWW
RECOMMENDED
XXXXG
SOLDERING FOOTPRINT*
G 8.750 0.344 XXXX = Specific Device Code A = Assembly Location Y = Year 3.790 WW = Work Week 2X 0.149 G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to 2.250 2X ǒ mm Ǔ SCALE 4:1 device data sheet for actual part marking. 0.089 inches Pb−Free indicator, “G” or microdot “ G”, may or may not be present. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON97675F
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DESCRIPTION: SMC 2−LEAD PAGE 1 OF 1
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