Datasheet LM337 (ON Semiconductor) - 8

LM337
80 3.5 PD(max) for TA = +50°C 70 3.0 TION (W) Free Air ANCE A ° Mounted Vertically 60 2.0 oz. Copper RESIST 2.5 L O‐AIR ( C/W) ÎÎÎÎ 50 Minimum 2.0 ÎÎÎÎ Size Pad L , THERMAL JA ÎÎÎÎ θ JUNCTION‐T 40 R 1.5 ÎÎÎÎ , MAXIMUM POWER DISSIP RqJA D P 30 1.0 0 5.0 10 15 20 25 30 L, LENGTH OF COPPER (mm)
Figure 19. D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length ORDERING INFORMATION Device Operating Temperature Range Package Shipping
† LM337BD2TR4G TJ = −40° to +125°C D2PAK 800 / Tape & Reel (Pb−Free) LM337BTG TO−220AB 50 Units / Rail (Pb−Free) LM337D2TR4G TJ = 0° to +125°C D2PAK 800 / Tape & Reel (Pb−Free) LM337TG TO−220AB 50 Units / Rail (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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