Package Information www.vishay.com Vishay Siliconix Case Outline for TO-251AA (High Voltage)OPTION 1: 4 3 A E1 Thermal PAD E A 4 b4 0.010 0.25 M C A B c2 L2 4 A θ1 θ2 D1 4 B D C 3 Seating plane 5 L3 C C L1 (Datum A) L B B A A1 3 x b2 c 3 x b View A - A 2 x e 0.010 0.25 M C A B Base 5 metal Plating b1, b3 Lead tip (c) c1 5 (b, b2) Section B - B and C - C MILLIMETERSINCHESMILLIMETERSINCHESDIM.MIN.MAX.MIN.MAX.DIM.MIN.MAX.MIN.MAX. A 2.18 2.39 0.086 0.094 D1 5.21 - 0.205 - A1 0.89 1.14 0.035 0.045 E 6.35 6.73 0.250 0.265 b 0.64 0.89 0.025 0.035 E1 4.32 - 0.170 - b1 0.65 0.79 0.026 0.031 e 2.29 BSC 2.29 BSC b2 0.76 1.14 0.030 0.045 L 8.89 9.65 0.350 0.380 b3 0.76 1.04 0.030 0.041 L1 1.91 2.29 0.075 0.090 b4 4.95 5.46 0.195 0.215 L2 0.89 1.27 0.035 0.050 c 0.46 0.61 0.018 0.024 L3 1.14 1.52 0.045 0.060 c1 0.41 0.56 0.016 0.022 1 0' 15' 0' 15' c2 0.46 0.86 0.018 0.034 2 25' 35' 25' 35' D 5.97 6.22 0.235 0.245 ECN: E21-0682-Rev. C, 27-Dec-2021 DWG: 5968 Notes • Dimensioning and tolerancing per ASME Y14.5M-1994 • Dimension are shown in inches and millimeters • Dimension D and E do not include mold flash. Mold flash shall not exceed 0.13 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body • Thermal pad contour optional with dimensions b4, L2, E1 and D1 • Lead dimension uncontrolled in L3 • Dimension b1, b3 and c1 apply to base metal only • Outline conforms to JEDEC® outline TO-251AA Revision: 27-Dec-2021 1 Document Number: 91362 For technical questions, contact: hvmos.techsupport@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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