Datasheet MIC5209 (Microchip) - 7

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MIC5209 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 5 sec. Junction Temperature TJ –40 — +125 °C 2.5V ≤ VOUT ≤ 15V Junction Temperature TJ 0 — +125 °C 1.8V ≤ VOUT < 2.5V
Package Thermal Resistance
θJA — 62 — °C/W EIA/JEDEC Thermal Resistance SOT-223 JES51-751-7, θJC — 15 — °C/W 4 Layer Board θJA — 50 — °C/W See Thermal Thermal Resistance SOIC-8 Considerations for more θJC — 25 — °C/W information. θJA — 31.4 — °C/W EIA/JEDEC Thermal Resistance DDPAK JES51-751-7, θJC — 3 — °C/W 4 Layer Board Thermal Resistance 3 mm x 3 mm θJA — 64 — °C/W EIA/JEDEC VDFN JES51-751-7, θJC — 12 — °C/W 4 Layer Board
Note 1:
The maximum al owable power dissipation is a function of ambient temperature, the maximum al owable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum al owable power dissipation wil cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  2017 - 2022 Microchip Technology Inc. and its subsidiaries DS20005720B-page 7 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves 3.0 Pin Descriptions 4.0 Applications Information 4.1 Enable/Shutdown 4.2 Input Capacitor 4.3 Output Capacitor 4.4 No-Load Stability 4.5 Reference Bypass Capacitor 4.6 Thermal Considerations 4.7 Low-Voltage Operation 4.8 Fixed Regulator Applications 4.9 Adjustable Regulator Applications 4.10 Slot-1 Power Supply 5.0 Packaging Information 5.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service