Datasheet MBT3906DW1 (ON Semiconductor) - 7

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363
CASE 419B−02 ISSUE Y 1 DATE 11 DEC 2012
SCALE 2:1 2X
aaa H D NOTES:
D H
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS.
A
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,
D
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU-
GAGE
SIONS, OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
PLANE
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H.
6 5 4
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
L2 L
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
E E1
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
DETAIL A
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
1 2 3
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI- aaa C
2X
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
2X 3 TIPS
RADIUS OF THE FOOT. bbb H D
e MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX B 6X b A
−−− −−− 1.10 −−− −−− 0.043 ddd M C
A1
0.00 −−− 0.10 0.000 −−− 0.004
TOP VIEW
A-B D
A2
0.70 0.90 1.00 0.027 0.035 0.039
b
0.15 0.20 0.25 0.006 0.008 0.010
C
0.08 0.15 0.22 0.003 0.006 0.009
A2 D
1.80 2.00 2.20 0.070 0.078 0.086
DETAIL A A E
2.00 2.10 2.20 0.078 0.082 0.086
E1
1.15 1.25 1.35 0.045 0.049 0.053
e
0.65 BSC 0.026 BSC
L
0.26 0.36 0.46 0.010 0.014 0.018
L2
0.15 BSC 0.006 BSC
aaa
0.15 0.006
bbb
0.30 0.012
ccc
0.10 0.004
6X
ccc C
A1 SEATING C c ddd
0.10 0.004
SIDE VIEW PLANE END VIEW GENERIC MARKING DIAGRAM* RECOMMENDED
6
SOLDERING FOOTPRINT*
6X 6X XXXMG 0.30 0.66 G 1 2.50 XXX = Specific Device Code M = Date Code* G = Pb−Free Package 0.65 (Note: Microdot may be in either location) PITCH DIMENSIONS: MILLIMETERS *Date Code orientation and/or position may vary depending upon manufacturing location. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and *This information is generic. Please refer to Mounting Techniques Reference Manual, SOLDERRM/D. device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42985B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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