Datasheet NOA1212 (ON Semiconductor) - 8

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS CUDFN6 1.6x1.6, 0.5P
CASE 505AL 1 ISSUE A
SCALE 2:1
DATE 09 FEB 2017 NOTES:
D A B
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED
PIN 1
TERMINAL AND IS MEASURED BETWEEN
E
0.10 AND 0.20MM FROM THE TERMINAL TIP. 4. COPLANARITY APPLIES TO THE EXPOSED
2X
0.10 C PAD AS WELL AS THE TERMINALS.
MILLIMETERS 2X
0.10 C
DIM MIN MAX A
0.55 0.65
TOP VIEW A1
0.00 0.05
A3
0.20 REF
A b
0.15 0.25 0.10 C
A3 b2
0.15 REF
D
1.60 BSC
D2
1.05 1.15
E
1.60 BSC 0.08 C
E2
0.45 0.55
A1 NOTE 4 C SEATING e
0.50 BSC
SIDE VIEW PLANE L
0.25 0.35
L2
0.17 REF 0.10 M
GENERIC L2
C A B
D2 MARKING DIAGRAM* PIN ONE 6X L REFERENCE
1 3 *No marking due to clear package 0.10 M C A B
RECOMMENDED E2 b2 MOUNTING FOOTPRINT*
6 4 1.20 6X
6X b
0.48
e
0.10 C A B 0.05 C
NOTE 3 BOTTOM VIEW
0.60 1.90 1 6X 0.28 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON89262F
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DESCRIPTION: CUDFN6, 1.6X1.6, 0.5P PAGE 1 OF 1
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