Datasheet NCP565, NCV565 (ON Semiconductor) - 3

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NCP565, NCV565 ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit
Input Voltage (Note 1) Vin 18 V Output Pin Voltage Vout −0.3 to Vin + 0.3 V Adjust Pin Voltage Vadj −0.3 to Vin + 0.3 V Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: This device series contains ESD protection and exceeds the following tests: Human Body Model JESD 22−A114−B Machine Model JESD 22−A115−A
THERMAL CHARACTERISTICS Rating Symbol Value Unit
Thermal Characteristics SOT−223 (Notes 1, 2) °C/W Thermal Resistance, Junction−to−Ambient RqJA 107 Thermal Resistance, Junction−to−Pin RqJP 12 Thermal Characteristics DFN6 (Notes 1, 2) °C/W Thermal Resistance, Junction−to−Ambient RqJA 176 Thermal Resistance, Junction−to−Pin RqJP 37 Thermal Characteristics D2PAK (5ld) (Notes 1, 2) °C/W Thermal Resistance, Junction−to−Case RqJC 3 Thermal Resistance, Junction−to−Ambient RqJA 83 Thermal Resistance, Junction−to−Pin RqJP 4
OPERATING RANGES Rating Symbol Value Unit
Operating Input Voltage (Note 1) Vin Vout + VDO, V 2.5 (Note 3) to 9 Operating Junction Temperature Range TJ −40 to 150 °C Operating Ambient Temperature Range TA −40 to 125 °C Storage Temperature Range Tstg −55 to 150 °C 1. Refer to Electrical Characteristics and Application Information for Safe Operating Area. 2. As measured using a copper heat spreading area of 50 mm2 for SOT−223 and DFN6, 100 mm2 for D2PAK, 1 oz copper thickness. 3. Minimum Vin = (Vout + VDO) or 2.5 V, whichever is higher.
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