Datasheet NSI50350AD (ON Semiconductor) - 7

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NSI50350ADT4G Thermal Considerations
T * T J(MAX) A As power in the CCR increases, it might become P + D(MAX) RqJA necessary to provide some thermal relief. The maximum Referring to the thermal table on page 2 the appropriate power dissipation supported by the device is dependent R upon board design and layout. Mounting pad configuration qJA for the circuit board can be selected. on the PCB, the board material, and the ambient temperature
AC Applications
affect the rate of junction temperature rise for the part. When The CCR is a DC device; however, it can be used with full the device has good thermal conductivity through the PCB, wave rectified AC as shown in application notes the junction temperature will be relatively low with high AND8433/D and AND8492/D and design notes power applications. The maximum dissipation the device DN05013/D and DN06065/D. Figure 14 shows the basic can handle is given by: circuit configuration.
Figure 14. Basic AC Application http://onsemi.com 7