Datasheet MOC3051M, MOC3052M, MOC3053M (ON Semiconductor) - 8

MOC3051M, MOC3052M, MOC3053M REFLOW PROFILE Figure 11. Reflow Profile Profile Feature Pb−Free Assembly Profile
Temperature Minimum (Tsmin) 150°C Temperature Maximum (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60 seconds to 120 seconds Ramp−up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 seconds to 150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp−down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum
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