Datasheet MMSZ, SZMM (ON Semiconductor) - 6

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOD−123
CASE 425−04 ISSUE G DATE 07 OCT 2009
SCALE 5:1 D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI
A1
Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
1 MILLIMETERS INCHES DIM MIN NOM MAX MIN NOM MAX
ÂÂÂÂ
A
0.94 1.17 1.35 0.037 0.046 0.053
A1
0.00 0.05 0.10 0.000 0.002 0.004 ÂÂÂÂ
H
0.024 0.028
E E b
0.51 0.61 0.71 0.020
c
--- --- 0.15 --- --- 0.006
D
1.40 1.60 1.80 0.055 0.063 0.071
E
2.54 2.69 2.84 0.100 0.106 0.112
H
3.56
E
3.68 3.86 0.140 0.145 0.152
L
0.25 --- --- 0.010 --- --- --- ° 10 ---
q
0 ° 0° 10°
2 q RECOMMENDED b L SOLDERING FOOTPRINT* C
0.91 0.036
GENERIC MARKING DIAGRAM*
ÉÉÉ ÉÉÉ 1.22 ÉÉÉ ÉÉÉ 0.048 XXXMG 1 G ÉÉÉ ÉÉÉ 2.36 0.093 XXX = Specific Device Code 4.19 M = Date Code 0.165 G = Pb−Free Package (Note: Microdot may be in either location) SCALE 10:1 ǒ mm Ǔ inches *This information is generic. Please refer to device data sheet for actual part marking. *For additional information on our Pb−Free strategy and soldering Pb−Free indicator, “G” or microdot “G”, may details, please download the
onsemi
Soldering and Mounting or may not be present. Some products may Techniques Reference Manual, SOLDERRM/D. not follow the Generic Marking. STYLE 1: PIN 1. CATHODE 2. ANODE
DOCUMENT NUMBER: 98ASB42927B
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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