Datasheet BT138-800E (NXP) - 10

NXP Semiconductors BT138-800E 4Q Triac 10. Package outline Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB SOT78
E A p A1 q mounting D1 base D L1(1) L2(1) Q b1(2) L (3×) b2(2) (2×)
1 2 3
b(3×) c e e 0 5 10 mm scale
DIMENSIONS (mm are the original dimensions) UNIT A A1 b b1(2) b2(2) c D D1 E e L L1(1) L2(1) max. p q Q
mm 4.7 1.40 0.9 1.6 1.3 0.7 16.0 6.6 10.3 15.0 3.30 3.8 3.0 2.6 4.1 1.25 0.6 1.0 1.0 0.4 15.2 5.9 9.7 2.54 12.8 2.79 3.0 3.5 2.7 2.2
Notes
1. Lead shoulder designs may vary. 2. Dimension includes excess dambar.
OUTLINE REFERENCES EUROPEAN VERSION PROJECTION ISSUE DATE IEC JEDEC JEITA
SOT78 08-04-23 3-lead TO-220AB SC-46 08-06-13
Fig. 12. Package outline TO-220AB (SOT78)
BT138-800E All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved
Product data sheet 30 August 2013 10 / 13
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Limiting values 8. Thermal characteristics 9. Characteristics 10. Package outline 11. Legal information