Datasheet MC74AC132, MC74ACT132 (ON Semiconductor) - 6

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOIC−14 NB
CASE 751A−03 14 ISSUE L 1 DATE 03 FEB 2016
SCALE 1:1 D A
NOTES: 1. DIMENSIONING AND TOLERANCING PER
B
ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 14 8 3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION
A3
SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.
E
4. DIMENSIONS D AND E DO NOT INCLUDE
H
MOLD PROTRUSIONS. 5. MAXIMUM MOLD PROTRUSION 0.15 PER
L
SIDE. 1 7
DETAIL A MILLIMETERS INCHES
0.25
DIM MIN MAX MIN MAX
M B M
13X b A
1.35 1.75 0.054 0.068 0.25 M C A S B S
A1
0.10 0.25 0.004 0.010
A3
0.19 0.25 0.008 0.010
h DETAIL A b
0.35 0.49 0.014 0.019
A D
8.55 8.75 0.337 0.344
X 45
_
E
3.80 4.00 0.150 0.157
e
1.27 BSC 0.050 BSC
H
5.80 6.20 0.228 0.244
h
0.25 0.50 0.010 0.019 0.10
A1 M L
0.40 1.25 0.016 0.049
e M
0 _ 7 _ 0 _ 7 _
C SEATING PLANE GENERIC SOLDERING FOOTPRINT* MARKING DIAGRAM*
6.50 14X 14 1.18 XXXXXXXXXG 1 AWLYWW 1 XXXXX = Specific Device Code A = Assembly Location 1.27 WL = Wafer Lot PITCH Y = Year WW = Work Week G = Pb−Free Package 14X *This information is generic. Please refer to 0.58 device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking. DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
STYLES ON PAGE 2 DOCUMENT NUMBER: 98ASB42565B
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