Datasheet NE570 (ON Semiconductor) - 10

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS SOIC−16 WB
CASE 751G ISSUE E DATE 08 OCT 2021 1
SCALE 1:1 GENERIC MARKING DIAGRAM*
16 XXXXXXXXXXX XXXXXXXXXXX AWLYYWWG 1 XXXXX = Specific Device Code A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “G”, may or may not be present. Some products may not follow the Generic Marking.
DOCUMENT NUMBER: 98ASB42567B
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DESCRIPTION: SOIC−16 WB PAGE 1 OF 1 onsemi
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