Datasheet NC7SP04 (ON Semiconductor) - 2

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NC7SP04 MAXIMUM RATINGS Symbol Characteristics Value Unit
VCC DC Supply Voltage −0.5 to +4.3 V VIN DC Input Voltage −0.5 to +4.3 V VOUT DC Output Voltage Active−Mode (High or Low State) −0.5 to VCC + 0.5 V Tri−State Mode (Note 1) −0.5 to +4.3 Power−Down Mode (VCC = 0 V) −0.5 to +4.3 IIK DC Input Diode Current VIN < GND −50 mA IOK DC Output Diode Current VOUT < GND −50 mA IOUT DC Output Source/Sink Current ±50 mA ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±50 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance (Note 2) SC−88A 377 °C/W MicroPak 154 PD Power Dissipation in Still Air SC−88A 332 mW MicroPak 812 MSL Moisture Sensitivity Level 1 − FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in − VESD ESD Withstand Voltage (Note 3) Human Body Model 4000 V Charged Device Model 2000 ILatchup Latchup Performance (Note 4) ±100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Applicable to devices with outputs that may be tri−stated. 2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7. 3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A (Machine Model) be discontinued. 4. Tested to EIA/JESD78 Class II.
RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 0.9 3.6 V VIN DC Input Voltage 0 3.6 V VOUT DC Output Voltage Active−Mode (High or Low State) 0 VCC Tri−State Mode (Note 1) 0 3.6 Power−Down Mode (VCC = 0 V) 0 3.6 TA Operating Temperature Range −40 +85 °C tr , tf Input Transition Rise and Fall Time VCC = 3.3 V ± 0.3 V 0 10 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.
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