Datasheet TLP5814H (Toshiba) - 3

TLP5814H 7. Principle of Operation 7.1. Truth Table Input LED VCLAMP M1 M2 M3 Output H ON > VtCLAMP ON OFF OFF H L OFF > VtCLAMP OFF ON OFF L L OFF < VtCLAMP OFF ON ON L 7.2. Mechanical Parameters Characteristics Dimensions Unit Height 2.3 (max) mm Creepage distances 8.0 (min) Clearance distances 8.0 (min) Internal isolation thickness 0.4 (min) 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 �) Characteristics Symbol Note Rating Unit LED Input forward current IF 25 mA Input forward current derating (Ta ≥ 100 �) ∆IF/∆Ta -0.4 mA/� Peak transient input forward current IFPT (Note 1) 1 A Peak transient input forward current (Ta ≥ 100 �) ∆IFPT/∆Ta -25 mA/� derating Input reverse voltage VR 5 V Input power dissipation PD (Note 3) 40 mW Input power dissipation derating (Ta ≥ 100 �) ∆PD/∆Ta (Note 3) -0.8 mW/� Detector Peak high-level output current (Ta = -40 to 125 �) IOPH (Note 2) -4.8 A Peak low-level output current (Ta = -40 to 125 �) IOPL (Note 2) +6.8 A Peak clamp sinking current (Ta = -40 to 125 �) ICLAMP (Note 2) +6.8 A Miller clamp pin voltage VCLAMP VEE to VCC V Detector Output voltage VO VEE to VCC V Supply voltage VCC-VEE -0.5 to 25 V Output power dissipation PO (Note 3) 810 mW Output power dissipation derating (Ta ≥ 100 �) ∆PO/∆Ta (Note 3) -10.4 mW/� Common Operating temperature Topr -40 to 125 � Storage temperature Tstg -55 to 150 Lead soldering temperature (10 s) Tsol (Note 4) 260 Isolation voltage AC, 60 s, R.H. ≤ 60 % BVS (Note 5) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Pulse width ≤ 1 µs, 300 pps Note 2: Pulse width ≤ 10 µs, single pulse Note 3: Mounting on the substrate made in accordance with JEDEC JESD51-7. Note 4: For the effective lead soldering area. Note 5: This device is considered as a two-terminal device: All pins on the LED side are shorted together, and all pins on the Output IC side are shorted together. ©2023-2025 3 2025-02-03 Toshiba Electronic Devices & Storage Corporation Rev.4.0