Datasheet TDA8920CTH (NXP) - 3

NXP Semiconductors TDA8920C 2
×
110 W class-D power amplifier 6. Block diagram
VDDA n.c. STABI PROT VDDP2 VDDP1 3 (20) 10 (4) 18 (12) 13 (7) 23 (16) 14 (8) 15 (9) BOOT1 9 (3) IN1M DRIVER INPUT PWM HIGH SWITCH1 8 (2) STAGE MODULATOR CONTROL IN1P 16 (10) AND OUT1 HANDSHAKE DRIVER mute 11 (5) LOW n.c. STABI VSSP1 7 (1) OSC
TDA8920CTH
TEMPERATURE SENSOR OSCILLATOR MANAGER 6 (23)
(TDA8920CJ)
V CURRENT PROTECTION DDP2 MODE MODE VOLTAGE PROTECTION 22 (15) BOOT2 2 (19) SGND DRIVER mute HIGH CONTROL 21 (14) 5 (22) SWITCH2 AND OUT2 IN2P HANDSHAKE INPUT PWM DRIVER 4 (21) STAGE MODULATOR LOW IN2M 1 (18) 12 (6) 24 (17) 19 (-) 17 (11) 20 (13) 001aai852 VSSA n.c. VSSD n.c. VSSP1 VSSP2 Pin numbers in brackets refer to type number TDA8920CJ.
Fig 1. Block diagram
TDA8920C_2 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 02 — 11 June 2009 3 of 39
Document Outline 1. General description 2. Features 3. Applications 4. Quick reference data 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description 8. Functional description 8.1 General 8.2 Pulse-width modulation frequency 8.3 Protection 8.3.1 Thermal protection 8.3.1.1 Thermal FoldBack (TFB) 8.3.1.2 OverTemperature Protection (OTP) 8.3.2 OverCurrent Protection (OCP) 8.3.3 Window Protection (WP) 8.3.4 Supply voltage protection 8.4 Differential audio inputs 9. Limiting values 10. Thermal characteristics 11. Static characteristics 12. Dynamic characteristics 12.1 Switching characteristics 12.2 Stereo SE configuration characteristics 12.3 Mono BTL application characteristics 13. Application information 13.1 Mono BTL application 13.2 Pin MODE 13.3 Estimating the output power 13.3.1 Single-Ended (SE) 13.3.2 Bridge-Tied Load (BTL) 13.4 External clock 13.5 Heatsink requirements 13.6 Pumping effects 13.7 Application schematic 13.8 Curves measured in reference design 14. Package outline 15. Soldering of SMD packages 15.1 Introduction to soldering 15.2 Wave and reflow soldering 15.3 Wave soldering 15.4 Reflow soldering 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Package related soldering information 17. Revision history 18. Legal information 18.1 Data sheet status 18.2 Definitions 18.3 Disclaimers 18.4 Trademarks 19. Contact information 20. Contents