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Datasheet TDA7056A (NXP) - 2

ПроизводительNXP
Описание3 W BTL mono audio output amplifier with DC volume control
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Язык документаанглийский

NXP Semiconductors. Product specificiation. 3 W BTL mono audio output amplifier with. TDA7056A. DC volume control. FEATURES

NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control FEATURES

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3 W BTL mono audio output amplifier with DC volume control
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TDA7056A/N2.112, Монофонический аудиоусилитель с мостовым включением нагрузки, 3Вт, 3В…18В, 20…20000Гц [HSIP-9]
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NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control FEATURES GENERAL DESCRIPTION
• DC volume control The TDA7056A is a mono BTL output amplifier with DC • Few external components volume control. It is designed for use in TV and monitors, but also suitable for battery-fed portable recorders and • Mute mode radios. • Thermal protection • Short-circuit proof
Missing Current Limiter (MCL)
• No switch-on and off clicks A MCL protection circuits is built-in. The MCL circuit is • Good overall stability activated when the difference in current between the output terminal of each amplifier exceeds 100 mA (typical • Low power consumption 300 mA). This level of 100 mA allows for headphone • Low HF radiation applications (single-ended). • ESD protected on all pins.
QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VP positive supply voltage range 4.5 − 18 V PO output power RL = 16 Ω; VP = 12 V 3 3.5 − W Gv voltage gain 34.5 35.5 36.5 dB φ gain control range 75 80 − dB IP total quiescent current VP = 12 V; RL = ∞ − 8 16 mA THD total harmonic distortion VP = 0.5 W − 0.3 1 %
ORDERING INFORMATION EXTENDED TYPE PACKAGE NUMBER PINS PIN POSITION MATERIAL CODE
TDA7056A 9 SIL plastic SOT110(1)
Note
1. SOT110-1. July 1994 2 Document Outline Features General description Missing Current Limiter (MCL) Quick reference data Ordering information Pinning Functional description Limiting values Thermal resistance Characteristics Application information Package outline Soldering Introduction Soldering by dipping or by wave Repairing soldered joints Data sheet status Disclaimers
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