Datasheet TDA7056A (NXP) - 9

link to page 9 link to page 9 NXP Semiconductors Product specificiation 3 W BTL mono audio output amplifier with TDA7056A DC volume control
SOLDERING
with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed
Introduction
5 seconds. There is no soldering method that is ideal for all IC The device may be mounted up to the seating plane, but packages. Wave soldering is often preferred when the temperature of the plastic body must not exceed the through-hole and surface mounted components are mixed specified maximum storage temperature (T on one printed-circuit board. However, wave soldering is stg max). If the printed-circuit board has been pre-heated, forced cooling not always suitable for surface mounted ICs, or for may be necessary immediately after soldering to keep the printed-circuits with high population densities. In these temperature within the permissible limit. situations reflow soldering is often used. This text gives a very brief insight to a complex technology.
Repairing soldered joints
A more in-depth account of soldering ICs can be found in Apply a low voltage soldering iron (less than 24 V) to the our “IC Package Databook” (order code 9398 652 90011). lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the
Soldering by dipping or by wave
soldering iron bit is less than 300 °C it may remain in The maximum permissible temperature of the solder is contact for up to 10 seconds. If the bit temperature is 260 °C; solder at this temperature must not be in contact between 300 and 400 °C, contact may be up to 5 seconds.
DATA SHEET STATUS DOCUMENT PRODUCT DEFINITION STATUS
(1)
STATUS
(2) Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
DISCLAIMERS
(including negligence), warranty, breach of contract or any other legal theory.
Limited warranty and liability
⎯ Information in this document is believed to be accurate and reliable. Notwithstanding any damages that customer might incur However, NXP Semiconductors does not give any for any reason whatsoever, NXP Semiconductors’ representations or warranties, expressed or implied, as to aggregate and cumulative liability towards customer for the accuracy or completeness of such information and the products described herein shall be limited in shall have no liability for the consequences of use of such accordance with the Terms and conditions of commercial information. sale of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any
Right to make changes
⎯ NXP Semiconductors indirect, incidental, punitive, special or consequential reserves the right to make changes to information damages (including - without limitation - lost profits, lost published in this document, including without limitation savings, business interruption, costs related to the specifications and product descriptions, at any time and removal or replacement of any products or rework without notice. This document supersedes and replaces all charges) whether or not such damages are based on tort information supplied prior to the publication hereof. July 1994 9 Document Outline Features General description Missing Current Limiter (MCL) Quick reference data Ordering information Pinning Functional description Limiting values Thermal resistance Characteristics Application information Package outline Soldering Introduction Soldering by dipping or by wave Repairing soldered joints Data sheet status Disclaimers