Datasheet BD14230FVJ-C (Rohm) - 4

BD1423x-C Series Absolute Maximum Ratings
Parameter Symbol Rating Unit Power Supply Voltage VDD 18.2 V Common Mode Voltage VCM -14 to +80 V Differential Voltage (VVINP -VVINM) VSENSE ±28 V VREF1 -0.3 to (V REF1, REF2, OFFSET Pin Voltage V DD + 0.3) or +18.2 REF2 V Whichever is less VOFFSET Input Current Into Any Pin IIN ±5 mA Storage Temperature Range Tstg -55 to +150 °C Maximum Junction Temperature Tjmax 150 °C
Caution 1:
Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.
Caution 2:
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance
(Note 5) Thermal Resistance (Typ) Parameter Symbol Unit 1s(Note 7) 2s2p(Note 8) TSSOP-B8J Junction to Ambient θJA 253.8 151.6 °C/W Junction to Top Characterization Parameter(Note 6) ΨJT 35 23 °C/W SOP-J8 Junction to Ambient θJA 149.3 76.9 °C/W Junction to Top Characterization Parameter(Note 6) ΨJT 18 11 °C/W (Note 5) Based on JESD51-2A (Still-Air). (Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 7) Using a PCB board based on JESD51-3. (Note 8) Using a PCB board based on JESD51-7. Layer Number of Material Board Size Measurement Board Single FR-4 114.3 mm x 76.2 mm x 1.57 mmt Top Copper Pattern Thickness Footprints and Traces 70 μm Layer Number of Material Board Size Measurement Board 4 Layers FR-4 114.3 mm x 76.2 mm x 1.6 mmt Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70 μm 74.2 mm x 74.2 mm 35 μm 74.2 mm x 74.2 mm 70 μm www.rohm.com
TSZ02201-0M2M0FC23020-1-2
© 2022 ROHM Co., Ltd. All rights reserved. 4/17 TSZ22111 • 15 • 001
03.Apr.2025 Rev.002
Document Outline General Description Features Applications Key Specifications Package Typical Application Circuit Pin Configuration Pin Descriptions Absolute Maximum Ratings Thermal Resistance Recommended Operating Conditions Electrical Characteristics Typical Performance Curves Timing Chart Application Examples I/O Equivalence Circuits Operational Notes Ordering Information Marking Diagram Physical Dimension and Packing Information Revision History