Datasheet 4N38M, H11D1M, H11D3M, MOC8204M (ON Semiconductor) - 6

4N38M, H11D1M, H11D3M, MOC8204M REFLOW PROFILE Figure 8. Reflow Profile Profile Feature Pb−Free Assembly Profile
Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60 − 120 seconds Ramp−up Rate (t to tP) 3°C / second max. Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 − 150 seconds Peak Body Package Temperature 260°C + 0°C / −5°C Time (tP) within 5°C of 260°C 30 seconds Ramp−down Rate (TP to TL) 6°C / second max. Time 25°C to Peak Temperature 8 minutes max.
Table 1. ORDERING INFORMATION Part Number Package Packing Method
† H11D1M DIP 6−Pin Tube (50 Units) H11D1SM SMT 6−Pin (Lead Bend) Tube (50 Units) H11D1SR2M SMT 6−Pin (Lead Bend) Tape and Reel (1000 Units) H11D1VM DIP 6−Pin, DIN EN/IEC60747−5−5 Option Tube (50 Units) H11D1SVM SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option Tube (50 Units) H11D1SR2VM SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option Tape and Reel (1000 Units) H11D1TVM DIP 6−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option Tube (50 Units) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 4. The product orderable part number system listed in this table also applies to the 4N38M, H11D3M, and MOC8204M devices.
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