Datasheet CLF24H4LS300P (Ampleon) - 4
| Производитель | Ampleon |
| Описание | RF power GaN-SiC HEMT |
| Страниц / Страница | 11 / 4 — CLF24H4LS300P. RF power GaN-SiC HEMT. 7. Application. information. 7.1 … |
| Формат / Размер файла | PDF / 1.2 Мб |
| Язык документа | английский |
CLF24H4LS300P. RF power GaN-SiC HEMT. 7. Application. information. 7.1 Test circuit. Fig 1. Component layout. Table 9. List of co
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CLF24H4LS300P RF power GaN-SiC HEMT 7. Application information 7.1 Test circuit
90 mm C16 C14 R4 C8 C7 C5 C12 C13 C15 C6 R2/R3 J1 J2 C9 C11 C1 C3 C4 R1 Q C2 C10 60 mm amp01859 Printed-Circuit Board (PCB): Rogers TC350; r = 3.5; thickness = 0.508 mm; thickness copper plating = 35 m. See Table 9 for a list of components.
Fig 1. Component layout Table 9. List of co mponents
See Figure 1.
Component Description Value Remarks
C1 multilayer ceramic chip capacitor 33 pF 5 % ATC: ATC600F330JW250XT C2 multilayer ceramic chip capacitor 1.0 pF 0.1 pF ATC: ATC600F1R0BW250XT C3 multilayer ceramic chip capacitor 0.8 pF 0.1 pF ATC: ATC600F0R8BW250XT C4, C11 multilayer ceramic chip capacitor 0.2 pF 0.1 pF ATC: ATC600F0R2BW250XT C5 multilayer ceramic chip capacitor 8.2 pF 5 % ATC: ATC600F8R2JW250XT C6, C13 multilayer ceramic chip capacitor 100 pF 5 % ATC: ATC600F101JW250XT C7, C14 multilayer ceramic chip capacitor 1000 pF 5 % ATC: ATC100B102JW50XT C8, C15 multilayer ceramic chip capacitor 10 F 10 % TDK: C3225X7R2A106K C9 multilayer ceramic chip capacitor 1 pF 0.1 pF ATC: ATC800R1R0BW500T C10 multilayer ceramic chip capacitor 1.2 pF 0.1 pF ATC: ATC800R1R2BW500T C12 multilayer ceramic chip capacitor 100 pF 5 % ATC: ATC600F102JW250XT C16 electrolytic capacitor 1000 F, 63 V Panasonic 20 % R1 resistor 5.1 5 % R2, R3 resistor 10 5 % CLF24H4LS300P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2024. All rights reserved.
Product data sheet Rev. 1 — 30 July 2024 4 of 11
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 7.1 Test circuit 7.2 Graphical data 7.3 Impedance information 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents
