Datasheet CLF24H4LS300P (Ampleon) - 6

CLF24H4LS300P RF power GaN-SiC HEMT 8. Package outline
Earless flanged ceramic package; 4 leads SOT1214B D F A D1 C U1 H1 c L W2O CO 1 2 H U2 E1 E 3 4 b L W3O Q e 0 5 10mm scale Dimensions Unit (1) A b c D D1 e E E1 F H H1 Q(2) U1 U2 w2 w3 max 4.72 6.17 0.15 20.02 19.96 9.53 9.50 1.14 19.94 1.70 20.70 9.91 mm nom 8.21 14.24 0.51 0.25 min 3.43 5.92 0.08 19.61 19.66 9.27 9.29 0.89 18.92 1.45 20.45 9.65 max 0.187 0.243 0.006 0.788 0.786 0.375 0.374 0.045 0.785 0.067 0.815 0.39 inches nom 0.323 0.56 0.02 0.01 min 0.135 0.233 0.003 0.772 0.774 0.365 0.366 0.035 0.745 0.057 0.805 0.38 Note 1. millimeter dimensions are derived from the original inch dimensions. 2. dimension is measured 0.030 inch (0.76) from body. sot1214b_po Outline References European Issue date version IEC JEDEC JEITA projection 14-03-27 SOT1214B 24-05-16
Fig 4. Package outline SOT1214B (sheet 1 of 2)
CLF24H4LS300P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2024. All rights reserved.
Product data sheet Rev. 1 — 30 July 2024 6 of 11
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 7.1 Test circuit 7.2 Graphical data 7.3 Impedance information 8. Package outline 9. Handling information 10. Abbreviations 11. Revision history 12. Legal information 12.1 Data sheet status 12.2 Definitions 12.3 Disclaimers 12.4 Trademarks 13. Contact information 14. Contents