SFH 320 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 T 240 ˚C p 245 ˚C 217 ˚C tP 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 2 3 K/s 25 °C to 150 °C Time t t 60 100 120 s S S T to T Smin Smax Ramp-up rate to peak*) 2 3 K/s T to T Smax P Liquidus temperature T 217 °C L Time above liquidus temperature t 80 100 s L Peak temperature T 245 260 °C P Time within 5 °C of the specified peak t 10 20 30 s P temperature T - 5 K P Ramp-down rate* 3 6 K/s T to 100 °C P Time 480 s 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 10 Version 1.7 | 2021-11-22
