Datasheet FOD410 (ON Semiconductor) - 9

FOD410, FOD4108, FOD4116, FOD4118 REFLOW PROFILE
245 _C, 10 to 30 seconds 300 250 260_C peak _
C)
200 150 100 Time above 183_C, < 160 seconds
Temperature (
50 Ramp up = 2 to 10_C/second 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5
Time (Minute)
•Peak reflow temperature: 262_C (package surface temperature) •Time of temperature higher than 18 5_C for 160 seconds or less •One time soldering reflow is recommended
Figure 14. Reflow Profile ORDERING INFORMATION Part Number Package Shipping
† FOD410 DIP 6−Pin Tube (50 Units) FOD410S SMT 6−Pin (Lead Bend) Tube (50 Units) FOD410SD SMT 6−Pin (Lead Bend) Tape and Reel (1000 Units) FOD410V DIP 6−Pin, DIN EN/IEC60747−5−5 Option Tube (50 Units) FOD410SV SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option Tube (50 Units) FOD410SDV SMT 6−Pin (Lead Bend), DIN EN/IEC60747−5−5 Option Tape and Reel (1000 Units) FOD410TV DIP 6−Pin, 0.4” Lead Spacing, DIN EN/IEC60747−5−5 Option Tube (50 Units) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 6. The product orderable part number system listed in this table also applies to the FOD4108, FOD4116, and FOD4118 product families.
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