Datasheet MMSZ52 (ON Semiconductor)

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DATA SHEET www.onsemi.com
Zener Voltage Regulators
500 mW SOD−123 Surface Mount
MMSZ52xxxT1G Series,
SOD−123 CASE 425
SZMMSZ52xxxT1G Series
STYLE 1
Three complete series of Zener diodes are offered in the convenient, 1 2 surface mount plastic SOD−123 package. These devices provide Cathode Anode a convenient alternative to the leadless 34−package style. Zener voltage in this series are specified with device junction in thermal
MARKING DIAGRAM
equilibrium.
Features
XXMG 1 • 500 mW Rating on FR−4 or FR−5 Board G • Wide Zener Reverse Voltage Range − 2.4 V to 110 V @ Thermal Equilibrium* XX = Device Code (Refer to page 3) • Package Designed for Optimal Automated Board Assembly M = Date Code • Small Package Size for High Density Applications G = Pb−Free Package • General Purpose, Medium Current (Note: Microdot may be in either location) • ESD Rating of Class 3 (> 16 kV) per Human Body Model
ORDERING INFORMATION
• SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and
Device Package Shipping
† PPAP Capable MMSZ52xxBT1G, SOD−123 3,000 / • These are Pb−Free Devices SZMMSZ52xxBT1G (Pb−Free) Tape & Reel MMSZ52xxCT1G, SOD−123 3,000 /
Mechanical Characteristics:
SZMMSZ52xxCT1G (Pb−Free) Tape & Reel
CASE:
Void-free, transfer-molded, thermosetting plastic case MMSZ52xxBT3G, SOD−123 10,000 /
FINISH:
Corrosion resistant finish, easily solderable SZMMSZ52xxBT3G (Pb−Free) Tape & Reel
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
MMSZ52xxCT3G, SOD−123 10,000 / 260°C for 10 Seconds SZMMSZ52xxCT3G (Pb−Free) Tape & Reel
POLARITY:
Cathode indicated by polarity band †For information on tape and reel specifications,
FLAMMABILITY RATING:
UL 94 V−0 including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications
MAXIMUM RATINGS
Brochure, BRD8011/D.
Rating Symbol Max Units DEVICE MARKING INFORMATION
Total Power Dissipation on FR−5 Board, PD See specific marking information in the device marking (Note 1) @ TL = 75°C 500 mW column of the Electrical Characteristics table on page 3 of Derated above 75°C 6.7 mW/°C this data sheet. Thermal Resistance, Junction−to−Ambient RqJA 340 °C/W (Note 2) Thermal Resistance, Junction−to−Lead RqJL 150 °C/W (Note 2) Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint. 2. Thermal Resistance measurement obtained via infrared Scan Method. *For additional info on thermal equilibrium, please download,
onsemi
TVS/Zener Theory and Design Considerations Handbook, HBD854/D. © Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
March, 2024 − Rev. 17 MMSZ5221BT1/D