Datasheet J270 (InterFET) - 4

InterFET
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J270-1 TO-92 Mechanical and Layout Data Package Outline Data
1. All linear dimensions are in millimeters. 2. Package weight approximately 0.19 grams 3. Molded plastic case UL 94V-0 rated 4. Bulk product is shipped in standard ESD shipping material 5. Refer to JEDEC standards for additional information.
Suggested Through-Hole Layout
1. All linear dimensions are in millimeters. 2. The suggested land pattern dimensions have been provided as a straight lead reference only. A more robust pattern may be desired for wave soldering and/or bent lead configurations. J270-1 4 of 4 InterFET Corporation Document Number: IF35090.R00 www.InterFET.com June, 2019