Datasheet FDMA430NZ (ON Semiconductor) - 6

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS WDFN6 2x2, 0.65P
CASE 511CZ ISSUE O DATE 31 JUL 2016 1.70 0.05 C 2.0 A (0.20) 2X B 1.00 No Traces 6 4 allowed in this Area 2.0 1.05 2.30 0.05 C 0.47(6X) PIN#1 IDENT TOP VIEW 2X 1 3 0.65 0.40(6X) 0.75±0.05 RECOMMENDED 0.10 C LAND PATTERN OPT 1 0.20±0.05 1.70 0.45 0.08 C SIDE VIEW (0.20) 0.025±0.025 C 1.00 SEATING 6 4 PLANE 2.00±0.05 (0.15) 1.05 0.66 (0.50) 0.90±0.05 0.30±0.05 PIN #1 IDENT 2.30 (0.20)4X 1 3 0.47(6X) 0.28±0.05 1 3 0.56±0.05 (6X) 0.40(7X) 0.65 1.00±0.05 RECOMMENDED (0.50) 2.00±0.05 LAND PATTERN OPT 2 NOTES: 6 4 0.30±0.05 (6X) A. PACKAGE DOES NOT FULLY CONFORM 0.65 TO JEDEC MO−229 REGISTRATION 0.10 C A B 1.30 B. DIMENSIONS ARE IN MILLIMETERS. 0.05 C BOTTOM VIEW C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 2009. D. LAND PATTERN RECOMMENDATION IS EXISTING INDUSTRY LAND PATTERN.
DOCUMENT NUMBER: 98AON13614G
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DESCRIPTION: WDFN6 2X2, 0.65P PAGE 1 OF 1 onsemi
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