Datasheet SN74LVC1G74 (Texas Instruments) - 6

link to page 6 link to page 6
SN74LVC1G74
SCES794G – OCTOBER 2009 – REVISED SEPTEMBER 2021
www.ti.com 6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Operating 1.65 5.5 VCC Supply voltage V Data retention only 1.5 VCC = 1.65 V to 1.95 V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VIH High-level input voltage V VCC = 3 V to 3.6 V 2 VCC = 4.5 V to 5.5 V 0.7 × VCC VCC = 1.65 V to 1.95 V 0.35 × VCC VCC = 2.3 V to 2.7 V 0.7 VIL Low-level input voltage V VCC = 3 V to 3.6 V 0.8 VCC = 4.5 V to 5.5 V 0.3 × VCC VI Input voltage 0 5.5 V VO Output voltage 0 VCC V VCC = 1.65 V –4 VCC = 2.3 V –8 IOH High-level output current –16 mA VCC = 3 V –24 VCC = 4.5 V –32 VCC = 1.65 V 4 VCC = 2.3 V 8 IOL Low-level output current 16 mA VCC = 3 V 24 VCC = 4.5 V 32 VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20 Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V VCC = 5 V ± 0.5 V 5 RSE Package –40 85 DQE Package TA Operating free-air temperature °C DCT Package –40 125 DCU Package (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6.4 Thermal Information SN74LVC1G74 THERMAL METRIC
(1)
DCT DCU RSE DQE UNIT 8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 220 227 243 261 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: SN74LVC1G74 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 Electrical Characteristics 6.6 Timing Requirements 6.7 Switching Characteristics 6.8 Operating Characteristics 6.9 Typical Characteristics 7 Parameter Measurement Information 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Power Button Circuit 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curves 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates 12.2 Support Resources 12.3 Trademarks 12.4 Electrostatic Discharge Caution 12.5 Glossary 13 Mechanical, Packaging, and Orderable Information