Datasheet ADA4961 (Analog Devices) - 6

ADA4961 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 4. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst case conditions, that is, a device Supply Voltage, VCCx 5.5 V soldered in a circuit board for surface-mount packages. PWUP, A4/CLK, A3/CS, A2/FA, A1, and A0 3.6 V
Table 5. Thermal Resistance
Input Voltage, VIN+ and VIN− +3.6 V to −1.2 V
Package Type θ
θ
JA θJC Unit
JA, Exposed Pad Soldered Down 50.92°C/W 24-Lead LFCSP 50.92 42.24 °C/W θJC at Exposed Pad 42.24°C/W Maximum Junction Temperature 140°C Operating Temperature Range −40°C to +85°C
ESD CAUTION
Storage Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 240°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 6 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS NOISE/HARMONIC PERFORMANCE TIMING SPECIFICATIONS Timing Diagram ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS CHARACTERIZATION AND TEST CIRCUITS AC CHARACTERIZATION OUTPUT FILTER THEORY OF OPERATION DIGITAL INTERFACE OVERVIEW PARALLEL DIGITAL INTERFACE SERIAL PERIPHERAL INTERFACE (SPI) Fast Attack APPLICATIONS INFORMATION BASIC CONNECTIONS ADC DRIVING LOW-PASS ANTIALIAS FILTERING FOR THE ADC INTERFACE LAYOUT CONSIDERATIONS EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE