Datasheet LT5400 (Analog Devices) - 10

LT5400
package DescripTion Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
(Reference LTC DWG # 05-08-1662 Rev I) BOTTOM VIEW OF EXPOSED PAD OPTION 1.88 1 (.074) 0.29 1.88 ± 0.102 1.68 REF (.074 ± .004) 0.889 ± 0.127 (.035 ± .005) (.066) 0.05 REF 5.23 DETAIL “B” (.206) 1.68 ± 0.102 3.20 – 3.45 CORNER TAIL IS PART OF MIN (.066 ± .004) (.126 – .136) DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 8
NO MEASUREMENT PURPOSE
3.00 ± 0.102 0.65 0.42 (.118 ± 0.038 ± .004) 0.52 (.0256) (.0165 ± .0015) (NOTE 3) BSC 8 7 6 5 (.0205) TYP REF RECOMMENDED SOLDER PAD LAYOUT 4.90 ± 0.152 3.00 ± 0.102 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.1016 ± 0.0508 (.009 – .015) (.004 ± .002) TYP 0.65 MSOP (MS8E) 0910 REV I NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6. EXPOSED PAD DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH ON E-PAD SHALL NOT EXCEED 0.254mm (.010") PER SIDE. 5400fc 10 For more information www.linear.com/LT5400 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Available Options Order Information Electrical Characteristics Typical Performance Characteristics Applications Information Typical Applications Package Description Revision History Typical Application Related Parts