Datasheet AD8061, AD8062, AD8063 (Analog Devices) - 6

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AD8061/AD8062/AD8063 Data Sheet ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 4. Parameter Rating
The maximum power that can be safely dissipated by the Supply Voltage 8 V AD8061/AD8062/AD8063 is limited by the associated rise in Internal Power Dissipation1 junction temperature. The maximum safe junction temperature 8-lead SOIC (R) 0.8 W for plastic encapsulated devices is determined by the glass 5-lead SOT-23 (RJ) 0.5 W transition temperature of the plastic, approximately 150°C. 6-lead SOT-23 (RJ) 0.5 W Temporarily exceeding this limit may cause a shift in parametric 8-lead MSOP (RM) 0.6 W performance due to a change in the stresses exerted on the die Input Voltage (Common-Mode) (−V by the package. Exceeding a junction temperature of 175°C for S − 0.2 V) to (+VS + 0.2 V) Differential Input Voltage ±V an extended period can result in device failure. While the S AD8061/AD8062/AD8063 is internally short-circuit protected, Output Short-Circuit Duration Observe power derating curves this may not be sufficient to guarantee that the maximum Storage Temperature Range −65°C to +125°C R-8, RM-8, SOT-23-5, SOT-23-6 junction temperature (150°C) is not exceeded under all Operating Temperature Range −40°C to +85°C conditions. Lead Temperature (Soldering, 300°C To ensure proper operation, it is necessary to observe the 10 sec) maximum power derating curves. 1 Specification is for device in free air.
2.0
8-Lead SOIC_N: θJA = 160°C/W; θJC = 56°C/W. 5-Lead SOT-23: θ
T
JA = 240°C/W; θJC = 92°C/W.
8-LEAD SOIC J = 150°C
6-Lead SOT-23: θ
W) PACKAGE
JA = 230°C/W; θJC = 92°C/W.
(
8-Lead MSOP: θ
1.5
JA = 200°C/W; θJC = 44°C/W.
TION
Stresses above those listed under Absolute Maximum Ratings
PA
may cause permanent damage to the device. This is a stress
ISSI D
rating only; functional operation of the device at these or any
1.0 ER
other conditions above those indicated in the operational
W
section of this specification is not implied. Exposure to absolute
M PO
maximum rating conditions for extended periods may affect
MU 0.5 MSOP XI
device reliability.
MA SOT-23-5, SOT-23-6
006
0
01065-
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE (°C)
Figure 6. Maximum Power Dissipation vs. Temperature for AD8061/AD8062/AD8063
ESD CAUTION
Rev. J | Page 6 of 20 Document Outline Features Applications Connection Diagrams General Description Revision History Specifications Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Typical Performance Characteristics Circuit Description Headroom Considerations Overload Behavior and Recovery Input Output Capacitive Load Drive Disable Operation Board Layout Considerations Applications Information Single-Supply Sync Stripper RGB Amplifier Multiplexer Outline Dimensions Ordering Guide