Datasheet LTC1440, LTC1441, LTC1442 (Analog Devices) - 14

LTC1440/LTC1441/LTC1442
U PACKAGE DESCRIPTIO DD Package 8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698) R = 0.115 0.38 ± 0.10 TYP 5 8 0.675 ±0.05 3.5 ±0.05 1.65 ±0.05 3.00 ±0.10 1.65 ± 0.10 2.15 ±0.05 (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 TOP MARK PACKAGE (NOTE 6) OUTLINE (DD8) DFN 1203 4 1 0.25 ± 0.05 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 0.50 BSC BSC 2.38 ±0.10 (2 SIDES) 2.38 ±0.05 0.00 – 0.05 (2 SIDES) BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE
MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) 3.20 – 3.45 MIN (.126 – .136) 3.00 ± 0.102 (.118 ± .004) 0.52 0.42 ± 0.038 0.65 (NOTE 3) 8 7 6 5 (.0205) (.0165 ± .0015) (.0256) REF TYP BSC RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.90 ± 0.152 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.127 ± 0.076 (.009 – .015) (.005 ± .003) TYP 0.65 MSOP (MS8) 0204 NOTE: (.0256) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 144012fd 14