Datasheet NA555, NE555, SA555, SE555 (Texas Instruments) - 4

NA555, NE555, SA555, SE555
SLFS022I – SEPTEMBER 1973 – REVISED SEPTEMBER 2014
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage(2) 18 V VI Input voltage CONT, RESET, THRES, TRIG VCC V IO Output current ±225 mA D package 97 P package 85 θJA Package thermal impedance(3)(4) °C/W PS package 95 PW package 149 FK package 5.61 θJC Package thermal impedance(5)(6) °C/W JG package 14.5 TJ Operating virtual junction temperature 150 °C Case temperature for 60 s FK package 260 °C Lead temperature 1,6 mm (1/16 in) from case for 60 s JG package 300 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to GND. (3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. (5) Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) - TC) / θJC. Operating at the absolute maximum TJ of 150°C can affect reliability. (6) The package thermal impedance is calculated in accordance with MIL-STD-883.
7.2 Handling Ratings PARAMETER DEFINITION MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
NA555, NE555, SA555 4.5 16 VCC Supply voltage V SE555 4.5 18 VI Input voltage CONT, RESET, THRES, and TRIG VCC V IO Output current ±200 mA NA555 –40 105 NE555 0 70 TA Operating free-air temperature °C SA555 –40 85 SE555 –55 125 4 Submit Documentation Feedback Copyright © 1973–2014, Texas Instruments Incorporated Product Folder Links: NA555 NE555 SA555 SE555 Document Outline 1 Features 2 Applications 3 Description 4 Simplified Schematic Table of Contents 5 Revision History 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Handling Ratings 7.3 Recommended Operating Conditions 7.4 Electrical Characteristics 7.5 Operating Characteristics 7.6 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Mono-stable Operation 8.3.2 A-stable Operation 8.3.3 Frequency Divider 8.4 Device Functional Modes 9 Applications and Implementation 9.1 Application Information 9.2 Typical Applications 9.2.1 Missing-Pulse Detector 9.2.1.1 Design Requirements 9.2.1.2 Detailed Design Procedure 9.2.1.3 Application Curves 9.2.2 Pulse-Width Modulation 9.2.2.1 Design Requirements 9.2.2.2 Detailed Design Procedure 9.2.2.3 Application Curves 9.2.3 Pulse-Position Modulation 9.2.3.1 Design Requirements 9.2.3.2 Detailed Design Procedure 9.2.3.3 Application Curves 9.2.4 Sequential Timer 9.2.4.1 Design Requirements 9.2.4.2 Detailed Design Procedure 9.2.4.3 Application Curves 10 Power Supply Recommendations 11 Device and Documentation Support 11.1 Related Links 11.2 Trademarks 11.3 Electrostatic Discharge Caution 11.4 Glossary 12 Mechanical, Packaging, and Orderable Information