Datasheet OPA2333, OPA333 (Texas Instruments) - 6

OPA333 , OPA2333
SBOS351E – MARCH 2006 – REVISED DECEMBER 2015
www.ti.com 6.4 Thermal Information: OPA333 OPA333 THERMAL METRIC(1) D (SOIC) DBV (SOT) DCK (SC70) UNIT 8 PINS 5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 140.1 220.8 298.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 89.8 97.5 65.4 °C/W RθJB Junction-to-board thermal resistance 80.6 61.7 97.1 °C/W ψJT Junction-to-top characterization parameter 28.7 7.6 0.8 °C/W ψJB Junction-to-board characterization parameter 80.1 61.1 95.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Thermal Information: OPA2333 OPA2333 THERMAL METRIC(1) D (SOIC) DGK (VSSOP) DRB (VSON) UNIT 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 124.0 180.3 46.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 73.7 48.1 26.3 °C/W RθJB Junction-to-board thermal resistance 64.4 100.9 22.2 °C/W ψJT Junction-to-top characterization parameter 18.0 2.4 1.6 °C/W ψJB Junction-to-board characterization parameter 63.9 99.3 22.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — 10.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated Product Folder Links: OPA333 OPA2333 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information: OPA333 6.5 Thermal Information: OPA2333 6.6 Electrical Characteristics 6.7 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 Operating Voltage 7.3.2 Input Voltage 7.3.3 Internal Offset Correction 7.3.4 Achieving Output Swing to the Op Amp Negative Rail 7.3.5 DFN Package 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 High-Side Voltage-to-Current (V-I) Converter 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curve 8.2.2 Precision, Low-Level Voltage-to-Current (V-I) Converter 8.2.2.1 Design Requirements 8.2.2.2 Detailed Design Procedure 8.2.2.3 Application Curves 8.2.3 Composite Amplifier 8.2.3.1 Design Requirements 8.2.3.2 Detailed Design Procedure 8.2.3.3 Application Curve 8.3 System Examples 8.3.1 Temperature Measurement Application 8.3.2 Single Operational Amplifier Bridge Amplifier Application 8.3.3 Low-Side Current Monitor Application 8.3.4 Other Applications 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.1.1 General Layout Guidelines 10.1.2 DFN Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Related Links 11.4 Community Resources 11.5 Trademarks 11.6 Electrostatic Discharge Caution 11.7 Glossary 12 Mechanical, Packaging, and Orderable Information