Реле Tianbo - ресурс 10 млн переключений

Datasheets - Керамические корпуса - 3

Подраздел: "Керамические корпуса"
Производители
Intersil Linear Technology
Найдено: 71 Вывод: 41-60

Вид: Список / Картинки

  1. 3 Pad Hermetic SMD.5 Package Ceramic Bottom Terminal Chip Carrier
  2. Корпус Intersil J28.A
    Mil-Std-1835 CQCC1-N28 (C-4) 28 Pad Ceramic Leadless Chip Carrier Package
Выбираем схему BMS для заряда литий-железофосфатных (LiFePO4) аккумуляторов
  1. Корпус Intersil J20.A
    Mil-Std-1835 CQCC1-N20 (C-2) 20 Pad Ceramic Leadless Chip Carrier Package
  2. Ceramic Flatpack Package
  1. Корпус Intersil K8.A
    8 Lead Ceramic Metal Seal Flatpack Package
  2. Top Brazed 42 Lead Ceramic Metal Seal Flatpack Package
  3. 4 Lead Ceramic Metal Seal Flatpack Package (100 mil Lead Pitch)
  4. Корпус Intersil K28.A
    Mil-Std-1835 CDFP3-F28(F-11A, Config B)28 Lead Ceramic Metal Seal Flatpack PKG
  5. 24 Lead Ceramic Metal Seal Flatpack Package
  6. Mil-Std-1835 CDFP4-F24(F-6A, Config B)24 Lead Ceramic Metal Seal Flatpack PKG
  7. Mil-Std-1835 CDFP4-F20(F-9A, Config B)20 Lead Ceramic Metal Seal Flatpack PKG
  8. 2 Lead Ceramic Metal Seal Flatpack Package
  9. 18 Lead Ceramic Metal Seal Flatpack Package with Bottom Metal
  10. 18 Lead Ceramic Metal Seal Flatpack Package
  11. 18 Lead Ceramic Metal Seal Ceramic Lid Flatpack Package
  12. 18 Lead Ceramic Metal Seal Flatpack Package
  13. 16 Lead Ceramic Metal Seal Flatpack Package
  14. 16 Lead Ceramic Metal Seal Flatpack Package
  15. 14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
  16. Mil-Std-1835 CDFP3-F14(F-2A, Config B)14 Lead Ceramic Metal Seal Flatpack PKG
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