Корпус Intersil W3x3.9D — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W3x3.9D
3x3 ARRAY 9 BALLS WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WITH BSC)
Rev 0, 1/14 X Y 1.410 В± 0.030 0.400 C
9 x 0.265 В± 0.035 1.410 В± 0.030 B
0.305
A (4X) 0.10
1
TOP VIEW 2 3 PIN 1
(A1 CORNER) 0.305
BOTTOM VIEW Z
0.05 SEATING PLANE Z 3 PACKAGE OUTLINE 0.240 0.040BSC
(BACK SIDE COATING) 0.400 0.265 В± 0.035 0.290 RECOMMENDED LAND PATTERN 0.10 Z X Y 0.05 Z 0.200 В± 0.030
0.540 В± 0.050
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5 -1994,
and JESD 95-1 SPP-010.
3. NSMD refers to Non-Solder Mask Defined pad design per
Intersil Tech Brief TB451 located at:
http://www.intersil.com/content/dam/Intersil/documents/
tb45/tb451.pdf 1 …