Datasheet ТI TPS79318YEQT — Даташит

Производитель	Texas Instruments
Серия	TPS793
Модель	TPS79318YEQT

Datasheets

Application Notes

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  NanoStarв„ў Wafer Chip-Scale Package Design Guide
  PDF, 286 Кб, Файл опубликован: 5 сен 2003
  To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale package, TI has introduced the 170Ојm NanoStar YEQ package. Since staggered ball WCSPs are not registered under the JEDEC MO-211 standard, there are no formal industry-standard guidelines on proper use of devices in this package. This application note gives guidelines for reliable, high-performance use of the YE
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  NanoStarв„ў & NanoFreeв„ў 300Ојm Solder Bump WCSP Application
  PDF, 749 Кб, Файл опубликован: 2 фев 2004
  The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel
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  Cycloneв„ў III FPGA Starter Kit Power Reference Design
  PDF, 314 Кб, Файл опубликован: 27 мар 2008
  This power supply was designed to power the 3C25F324 starter kit. This reference design has many benefits over the existing power supply found on the starter kit demonstration board.

Модельный ряд

Классификация производителя

• Semiconductors > Power Management > Linear Regulator (LDO) > Single Channel LDO