Корпус Intersil R64.B — Даташит

Hermetic Packages for Integrated Circuits Package Outline Drawing
R64.B
64 CERAMIC QUAD FLATPACK PACKAGE (CQFP) WITH E-PAD
Rev 2, 10/13
1.118 (28.40)
1.080 (27.43)
0.567 (14.40)
0.547 (13.90) 0.290 (7.37)
0.255 (6.48)
49 64 0.025 (0.635) BSC
1 PIN 1
INDEX AREA 48 0.567 (14.40)
0.547 (13.90) 1.118 (28.40)
1.080 (27.43) 0.010 (0.25)
0.006 (0.15) 33 16
17 32 TOP VIEW SEE DETAIL "A" 0.105 (2.67)
0.075 (1.91) 0.0075 (0.188)
0.005 (0.125) 0.008 (0.20)
REF SIDE VIEW 0.380 (9.655)
0.370 (9.395) DETAIL “A” 0.100 (2.537)
0.085 (2.157) 0.359 (9.12)
0.349 (8.86) METALIZED E-PAD
[THICKNESS 0.003 (0.076) MAX] …