Datasheet LTC2226H (Analog Devices) - 16

LTC2226H
PACKAGE DESCRIPTION LX Package 48-Lead Plastic LQFP (7mm
×
7mm)
(Reference LTC DWG # 05-08-1760 Rev Ø) 7.15 – 7.25 9.00 BSC 5.50 REF 7.00 BSC 48 48 SEE NOTE: 4 1 1 2 2 0.50 BSC 9.00 BSC 5.50 REF 7.00 BSC 7.15 – 7.25 0.20 – 0.30 A A PACKAGE OUTLINE C0.30 – 0.50 1.30 MIN RECOMMENDED SOLDER PAD LAYOUT APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 1.60 11° – 13° 1.35 – 1.45 MAX R0.08 – 0.20 GAUGE PLANE 0.25 0° – 7° 11° – 13° 0.09 – 0.20 0.50 0.05 – 0.15 1.00 REF BSC 0.17 – 0.27 LX48 LQFP 0907 REVØ 0.45 – 0.75 SECTION A – A NOTE: 1. PACKAGE DIMENSIONS CONFORM TO JEDEC #MS-026 PACKAGE OUTLINE 4. PIN-1 INDENTIFIER IS A MOLDED INDENTATION, 0.50mm DIAMETER 2. DIMENSIONS ARE IN MILLIMETERS 5. DRAWING IS NOT TO SCALE 3. DIMENSIONS OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.25mm ON ANY SIDE, IF PRESENT 2226hfc 16