Datasheet VL53L3CX (STMicroelectronics) - 20

VL53L3CX Outline drawings 6 Outline drawings
ST delivers any of the two alternative dual source cap assemblies as detailed in the drawings below. Both versions are transparent for the customer, since the pad and substrate design are identical for both versions and have no impact on customer PCB design. Ranging performances, reflow, and technical parameters are identical for both module designs presented in the second figure below.
Figure 16. Outline drawing 1/4
5.017-Oct-2017DM00392521ACTIVE
{pN_1}
F E D C B A Position Diameter Angular 2 Place Decimals 1 Place 0 Place Decimals Linear T C olerances, unless op yrigh 0.80 ST t ST Decimals 0.0 ±0.05 Restricted M icr 0.50 oe 2.40 ±0.05 1 lec 1 t 0.10 ron ic 0.00 ±0.05 0.665 s 0 otherwise stated 0.50 ±2 ±0.05 0.80 1.20 +0.05 degrees PWB SOLDER P 3.70 2 A 2 TTERN 1.85 0.08 4.40 ±0.05 3RD Angle Interpret drawing 3 Projection per BS8888, 0.25 PIN 1 3 2.10 3 N Material 6. 5. 4. 3. 2. 1. Notes: O Finish TICE: This d SEE INDIVIDUAL P A DRA EITHER 8575850 OR DM00418317 CAN 0.005 THK NICKEL. MET CONES. WILL INTERFERE SHEET 3 SHOWS EXCLUSIO DIMENSIONS UNSPECIFIED DIMENSIONS oc PPLICABLE T um ent WINGS AL CONNECTION P m ay have been +0.05 re ARE SHOWN WITH DM00418317 BUT THE SAME DIMENSIONS vis 1 4 e T MARKED - 0.10 d RADII 0.05. sin O O EDG ce i 8575850, UNLESS SPECIFIED. Z C t w WITH MO O N T as p r AR ROLL inted E ED . C TS 0.31 ±0.04 D h A O O CU eck DS 1-12 ARE ELE F MOUDLE ARE CORRECT A M D o 0 ENT cum DULE OPERA N CONES T en ARE INS t Manage m ent 5 Syste BE PE m f O BE KEPT FREE OF MECHANICAL or CTIO la U 0.15 ±0.10 t TION; THEY ARE NOT SYSTEM es CTROL t v SED FOR EWOK EVO MO ersion N DIMENSION be 0.80 1.60 fore u YTIC PLA s 0 IN 12 POS. ing Part No. Date Drawn or MR LOPEZ cop T DA 0.50 ying. DM00392521 31 JUL 2017 0.35 ±0.10 TED 0.0003 THK GOLD TUM "Z". S CHECKED A 6 6 0.08 BORBONES 0 1 12 11 5.00 4.00 3.00 REV . DULE ASSEMBL DRAFT OMITTED ON P ADDED: NO A D T 0.80 CAPS, NEW ISOMETRIC VIEWS ON PER RAFT NOTED ON P itle ALL DIMENSIONS PERFORMANCE T OQC. 2
VL53L3CX A
10 STMicroelectronics ARE ITEMS WHICH T U RE
PLLL
T VL53L3C D E 5, SH E P OVER 1.60 T N H U 7 3 OTED ON P S FOR CAP A E AGE 1. LINER THICKNESS UPD AGE 1. NEW NOTE 3 ON P EET 2 - T DESCRIPTION 7 nau X Y
YMM
t MODU . ho REVISIONS r IN mm iz OP VIEW DET AGE ed rep LE O - 2.40 SSEMBL rod 4 2. SHEETS 3 AND 4. u Imaging c P tion U AD No. CONNECTION T Y DM00418317 T an AILS ON TWO L Do Not Scale 12 1 10 d I 1 9 8 7 6 5 4 3 2 1 c N AGE om E Division m 3.20 D un 5 RA 6 7 1. A i TED. cation WING A A FUNCTION s VDDVCSEL tr VSSVCSEL ict 8 l GND4 A GPIO1 GND3 XSHUT GND2 8 29 SEPT 2017 23 AUG 1 SEPT 2017 y p VDD SCL SDA DNC GND PAG ro DA h ABLE E ib 1 OF TE it Sheet 25:1 Scale
1/4
ed 8 2017 4 F E D C B A 9
DS13204
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Rev 2 page 20/35
Document Outline Cover image Features Application Description 1 Product overview 1.1 Technical specification 1.2 System block diagram 1.3 Device pinout 1.4 Application schematic 2 Functional description 2.1 System functional description 2.2 State machine description 2.3 Customer manufacturing calibration flow 2.4 Device programming and control 2.5 Ranging mode description 2.6 Digital processing 2.7 Reading the results 2.8 Power sequence 2.8.1 Power up and boot sequence 2.9 Ranging sequence 2.10 Handshake management 3 Control interface 3.1 I2C interface - timing characteristics 3.2 I2C interface - reference registers 4 Electrical characteristics 4.1 Absolute maximum ratings 4.2 Recommended operating conditions 4.3 Electrostatic discharge 4.4 Current consumption 4.5 Digital input and output 5 Ranging performances 5.1 Measurement conditions 5.2 Minimum ranging distance 5.3 Maximum ranging distance 5.4 Ranging accuracy 5.5 Ranging drift with temperature 6 Outline drawings 7 Laser safety considerations 8 Packaging and labeling 8.1 Product marking 8.2 Inner box labeling 8.3 Packing 8.4 Tape and outline drawing 8.5 Lead-free solder reflow process 8.6 Handling and storage precautions 8.6.1 Shock precaution 8.6.2 Part handling 8.6.3 Compression force 8.6.4 Moisture sensitivity level 8.7 Storage temperature conditions 9 Package information 10 Ordering information 11 Acronyms and abbreviations Revision history Contents