TDA8920C 2 × 110 W class-D power amplifier Rev. 02 — 11 June 2009Product data sheet1.General description The TDA8920C is a high-efficiency class-D audio power amplifier. The typical output power is 2 × 110 W with a speaker load impedance of 4 Ω. The TDA8920C is available in both HSOP24 and DBS23P power packages. The amplifier operates over a wide supply voltage range from ±12.5 V to ±32.5 V and features low quiescent current consumption. 2.Features n Pin compatible with TDA8950/20B for both HSOP24 and DBS23P packages n Symmetrical operating supply voltage range from ±12.5 V to ±32.5 V n Stereo full differential inputs, can be used as stereo Single-Ended (SE) or mono Bridge-Tied Load (BTL) amplifier n High output power in typical applications: u SE 2 × 110 W, RL = 4 Ω (VP = ±30 V) u SE 2 × 125 W, RL = 4 Ω (VP = ±32 V) u SE 2 × 120 W, RL = 3 Ω (VP = ±29 V) u BTL 1 × 220 W, RL = 8 Ω (VP = ±30 V) n Low noise n Smooth pop noise-free start-up and switch off n Zero dead time switching n Fixed frequency n Internal or external clock n High efficiency n Low quiescent current n Advanced protection strategy: voltage protection and output current limiting n Thermal FoldBack (TFB) n Fixed gain of 30 dB in SE and 36 dB in BTL applications n Fully short-circuit proof across load n BD modulation in BTL configuration 3.Applications n DVD n Mini and micro receiver n Home Theater In A Box (HTIAB) system n High-power speaker system Document Outline 1. General description 2. Features 3. Applications 4. Quick reference data 5. Ordering information 6. Block diagram 7. Pinning information 7.1 Pinning 7.2 Pin description 8. Functional description 8.1 General 8.2 Pulse-width modulation frequency 8.3 Protection 8.3.1 Thermal protection 8.3.1.1 Thermal FoldBack (TFB) 8.3.1.2 OverTemperature Protection (OTP) 8.3.2 OverCurrent Protection (OCP) 8.3.3 Window Protection (WP) 8.3.4 Supply voltage protection 8.4 Differential audio inputs 9. Limiting values 10. Thermal characteristics 11. Static characteristics 12. Dynamic characteristics 12.1 Switching characteristics 12.2 Stereo SE configuration characteristics 12.3 Mono BTL application characteristics 13. Application information 13.1 Mono BTL application 13.2 Pin MODE 13.3 Estimating the output power 13.3.1 Single-Ended (SE) 13.3.2 Bridge-Tied Load (BTL) 13.4 External clock 13.5 Heatsink requirements 13.6 Pumping effects 13.7 Application schematic 13.8 Curves measured in reference design 14. Package outline 15. Soldering of SMD packages 15.1 Introduction to soldering 15.2 Wave and reflow soldering 15.3 Wave soldering 15.4 Reflow soldering 16. Soldering of through-hole mount packages 16.1 Introduction to soldering through-hole mount packages 16.2 Soldering by dipping or by solder wave 16.3 Manual soldering 16.4 Package related soldering information 17. Revision history 18. Legal information 18.1 Data sheet status 18.2 Definitions 18.3 Disclaimers 18.4 Trademarks 19. Contact information 20. Contents
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