Корпус Intersil L10.3x2 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L10.3x2
10 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE WITH E-PAD (TDFN)
Rev 1, 4/15
1.40
2.00 6
A PIN #1 INDEX AREA B 1 0.50 2.39 3.00 6
PIN 1
INDEX AREA 0.25 (4X) 0.15
(10x0.30)
0.84 TOP VIEW BOTTOM VIEW
(10x0.20) Package Outline
(10x0.30)
(10X0.25) 0.75 SEE DETAIL "X"
C BASE PLANE
SEATING PLANE
0.08 C SIDE VIEW 3.00 2.39 0.05 (8x 0.50)
0.20 REF 5 C 0.84
2.00 0.05 DETAIL “X” TYPICAL RECOMMENDED LAND PATTERN NOTES:
1.
2.
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4. Dimensions are in mm. Dimensions in ( ) for reference only. …