Корпус Intersil L8.3x3H — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
L8.3x3H
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (TDFN)
Rev 1, 5/15
2.38
1.50 REF
3.00 A PIN #1 INDEX AREA 6
PIN 1
INDEX AREA 6 X 0.50 6
B 1 8 X 0.40 4 2.20
3.00 (4X) 1.64 0.15
5 8 0.10 M C A B TOP VIEW 8 X 0.25 BOTTOM VIEW
( 2.38 )
SEE DETAIL "X" 0 .80 MAX 0.10 C C BASE PLANE
SEATING PLANE
0.08 C 2 . 80 ( 2 .20 ) SIDE VIEW ( 1.64 ) C 0.2 REF 8X 0.60
0 . 00 MIN.
0 . 05 MAX.
( 8X 0.25 ) DETAIL “X” ( 6X 0 . 5 ) NOTES:
TYPICAL RECOMMENDED LAND PATTERN 1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal В± 0.05 …