Новости - Беспроводные - 7

NXP Semiconductors introduced the MMZ25332B4 InGaP HBT linear amplifier. The device is housed in a 4 mm × 4 mm QFN package that can be used on thicker printed circuit boards (PCB), particularly where thermal sensitivity is high. The ...

The Bluetooth v4.2 certified nRF52832 is the first of Nordic Semiconductor’s nRF52 Series Systems-on-Chip and is supported by a full range of development kits, software, and documentation, now fully finalized from the previous Beta versions ...

Redpine's WiSeMCU™ module family includes ARM Cortex M4 MCU with advanced security for IoT devices in a small 8.6 mm × 8.6 mm form factor Redpine Signals announced the launch of the world’s first wireless microcontroller module ...

GreenPeak’s low-cost lighting solution is future-proof for multiple communication protocols GreenPeak Technologies has launched its wireless LED Lighting solution, a low-cost ambient lighting application based on the new GreenPeak GP651 ...

TI's SimpleLink™ Sub-1 GHz CC1310 wireless MCUs now available with the lowest power and high RF performance for the IoT Texas Instruments announced the availability of the next device in the SimpleLink™ ultra-low power platform, ...

Micrel Inc. introduced the MICRF229 and the MICRF230, low-power, 400 MHz to 450 MHz, super-heterodyne, image reject, OOK/ASK receivers. Both devices feature 112 dBm sensitivity at a data rate of 1 kbps and operate from 3.5 V to 5.5 V. They consume ...

u-blox announces full production availability of the ELLA-W1 series of compact, automotive-grade, multiradio modules. The modules promise predictable, reliable results and easy implementation of in-car wireless connectivity. Applications include ...

At the 2015 International Solid State Circuits Conference (ISSCC), imec and Panasonic presented a transceiver chip for phase-modulated continuous-wave radar at 79 GHz. This achievement demonstrates the potential of downscaled CMOS for cheap ...