Корпус Intersil W3x2.6D — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W3x2.6D
6 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm pitch)
Rev 2, 8/15 X 0.400 1.360В±0.030 Y 0.400 2
0.865В±0.030
6x 0.265В±0.035
(2X) 1
C 0.10
PIN 1
(A1 CORNER) B A
0.233 0.400 0.280 TOP VIEW
BOTTOM VIEW Z SEATING PLANE 0.05 Z 3 PACKAGE OUTLINE
0.240
0.040 BSC
(BACKSIDE COATING) 0.400 0.265В±0.035 0.290 4 0.10 M Z X Y
0.05 M Z 6 NSMD
0.200В±0.030 RECOMMENDED LAND PATTERN
0.540В±0.050
SIDE VIEW NOTES:
1. Dimensions and tolerance per ASME Y 14.5M -1994.
2. Dimension is measured at the maximum bump diameter
parallel to primary datum Z .
3. Primary datum Z and seating plane are defined by the spherical …