Корпус Intersil W6x9.54 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W6x9.54
54 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm PITCH)
Rev 0, 10/15 X 2.551 В±0.030 Y 0.400
J
54x 0.265 В±0.035 H
G
F 3.670 В±0.030 E
D
C 0.235 B
A
(4X) 1 2 3 4 5 6 0.10 TOP VIEW PIN 1
(A1 CORNER) 0.276 0.200
BOTTOM VIEW PACKAGE
OUTLINE 0.215 0.400 0.05 Z Z SEATING PLANE
3 0.265
0.265 В±0.035
0.10
0.05 6 NSMD 0.200 В±0.030
0.500 В±0.050 TYPICAL RECOMMENDED LAND PATTERN
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASME Y 14.5M -1994. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. …