Корпус Intersil W4x4.16 — Даташит

Plastic Packages for Integrated Circuits Package Outline Drawing
W4x4.16
4X4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 0, 6/10
X 1.965В±0.02 Y 1.20 16X 0.270 В± 0.025 LOGO ID
4
3
1.20 1.815В±0.02
PIN 1 2
0.40
1
0.10 D (4X) TOP VIEW A
C
B
BOTTOM VIEW 0.305 В± 0.025 0.535 mm MAX 0.10 Z 0.27 В± 0.025 Z SEATING PLANE Г?0.10 M Z X Y
Г?0.05 M Z 0.19 В± 0.015 0.05 Z SIDE VIEW 0.275 PACKAGE
OUTLINE NOTES:
1. All dimensions are in millimeters.
2. Dimension and tolerance per ASMEY 14.5M-1994,
and JESD 95-1 SPP-010.
3. NSMD refers to Non-solder Mask Defined pad design per
Intersil Tech Brief TB451 located at:
http://www.intersil.com/data/tb/tb451.pdf. …